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| MCC Features * * * * omponents 21201 Itasca Street Chatsworth !"# $ % !"# S1A THRU S1M For Surface Mount Applications Extremely Low Thermal Resistance Easy Pick And Place High Temp Soldering: 250C for 10 Seconds At Terminals 1 Amp Silicon Rectifier 50 to 1000 Volts DO-214AA (SMBJ) (Round Lead) H Cathode Band * * * Maximum Ratings Operating Temperature: -55C to +150C Storage Temperature: -55C to +150C Maximum Thermal Resistance; 30C/W Junction To Lead MCC Catalog Number S1A S1B S1D S1G S1J S1K S1M Device Marking S1A S1B S1D S1G S1J S1K S1M Maximum Recurrent Peak Reverse Voltage 50V 100V 200V 400V 600V 800V 1000V Maximum RMS Voltage 35V 70V 140V 280V 420V 560V 700V Maximum DC Blocking Voltage 50V 100V 200V 400V 600V 800V 1000V DIM A B C D E F G H J J A C E F G D B DIMENSIONS INCHES MIN .078 .075 .002 ----.035 .065 .205 .160 .130 MM MIN 1.98 1.90 .05 ----.90 1.65 5.21 4.06 3.30 Electrical Characteristics @ 25C Unless Otherwise Specified Average Forward current Peak Forward Surge Current Maximum Instantaneous Forward Voltage Maximum DC Reverse Current At Rated DC Blocking Voltage Typical Junction Capacitance IF(AV) IFSM VF IR CJ 1.0A 30A 1.1V 5A 50A 12pF TJ = 100C 8.3ms, half sine, IFM = 1.0A; TJ = 25C* TJ = 25C TJ = 125C Measured at 1.0MHz, VR=4.0V MAX .116 .089 .008 .02 .055 .091 .224 .180 .155 MAX 2.95 2.25 .20 .51 1.40 2.32 5.69 4.57 3.94 NOTE SUGGESTED SOLDER PAD LAYOUT 0.090" 0.085" *Pulse test: Pulse width 300 sec, Duty cycle 2% 0.070" www.mccsemi.com S1A thru S1M Figure 1 Typical Forward Characteristics 20 10 6 4 2 Amps 1 .6 .4 .2 25C .1 .06 .04 .02 .01 .4 .6 .8 Volts Instantaneous Forward Current - Amperesversus Instantaneous Forward Voltage - Volts 1.0 1.2 1.4 Amps 1.4 1.2 1.0 .8 .6 .4 Resistive or .2 Inductive Load 0 0 20 40 60 Figure 4 Forward Derating Curve 1 10 Cycles Amps 36 30 24 18 12 6 Figure 3 Maximum Overload Surge Current MCC 100 Peak Forward Current - Amperesversus Number of Cycles at 60Hz 80 100 120 140 160 180 200 Figure 2 Junction Capacitance C Average Forward Rectified Current - Amperes versus Ambient Temperature - C 100 60 40 20 pF 10 6 4 2 1 .1 .2 .4 1 Volts 2 4 10 20 40 100 200 400 1000 Median Typical Distribution Junction Capacitance - pFversus Reverse Junction Potential (Applied V + 0.7 Volts) - Volts www.mccsemi.com S1A thru S1M Figure 5 Peak Forward Surge Current 1000 600 400 200 Amps 100 60 40 20 10 .01 .02 .06 .1 .2 mS Peak Forward Surge Current - Amperesversus Pulse Duration - Milliseconds (mS) .6 1 2 6 10 MCC Figure 6 New SMB Assembly Round Lead Process www.mccsemi.com |
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